详细信息
产品培训模块:
Board-to-Board Connectors
产品目录绘图: TSW Series Dual
标准包装:1
系列:TSW
包装:散装
触头类型:公形引脚
连接器类型:接头,无罩
针脚数:92
加载的针脚数:全部
间距:0.100"(2.54mm)
排数:2
排距:0.100"(2.54mm)
触头配接长度:0.230"(5.84mm)
安装类型:通孔
端接:焊接
紧固类型:-
特性:-
触头镀层:金
触头镀层厚度:30µin(0.76µm)
颜色:黑
配套产品:SAM1223-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1221-46-ND - CONN RCPT .100" 92POS DUAL TIN
SAM1218-46-ND - CONN RCPT .100" 92PS DL R/A GOLD
SAM1217-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1215-46-ND - CONN RCPT .100" 92PS DL R/A GOLD
SAM1214-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1212-46-ND - CONN RCPT .100" 92POS DUAL TIN
SAM1210-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1208-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1205-46-ND - CONN RCPT .100" 92POS DL R/A TIN
更多...
产品目录绘图: TSW Series Dual
标准包装:1
系列:TSW
包装:散装
触头类型:公形引脚
连接器类型:接头,无罩
针脚数:92
加载的针脚数:全部
间距:0.100"(2.54mm)
排数:2
排距:0.100"(2.54mm)
触头配接长度:0.230"(5.84mm)
安装类型:通孔
端接:焊接
紧固类型:-
特性:-
触头镀层:金
触头镀层厚度:30µin(0.76µm)
颜色:黑
配套产品:SAM1223-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1221-46-ND - CONN RCPT .100" 92POS DUAL TIN
SAM1218-46-ND - CONN RCPT .100" 92PS DL R/A GOLD
SAM1217-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1215-46-ND - CONN RCPT .100" 92PS DL R/A GOLD
SAM1214-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1212-46-ND - CONN RCPT .100" 92POS DUAL TIN
SAM1210-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1208-46-ND - CONN RCPT .100" 92POS DUAL GOLD
SAM1205-46-ND - CONN RCPT .100" 92POS DL R/A TIN
更多...